Industry insider Digital Chat Station has revealed details about MediaTek‘s upcoming flagship chipset for 2025, suggesting a significant leap in performance. Reportedly named the Dimensity 9500, the SoC will be manufactured using TSMC’s advanced N3P process, an upgrade from the N3E node used in its predecessors.
MediaTek Dimensity 9500 SoC Spec Leaks
A key highlight is the all-large core CPU architecture, featuring a configuration of 1x “Travis,” 3x “Alto,” and 4x “Gelas” cores. While “Alto” remains undisclosed, “Travis” is anticipated to be ARM’s next-generation Cortex-X core, potentially clocking in above 4GHz, and “Gelas” is expected to be the Cortex-A7xx series. The chip will also boast a substantial 16MB of L3 cache and 10MB of system-level cache.
Further enhancing performance, the Dimensity 9500 will support high-speed LPDDR5X RAM up to 10,667Mbps and 4-lane UFS 4.1 storage. Graphics will be handled by an Immortalis-Drage GPU with enhanced ray tracing capabilities and improved power efficiency.
Artificial intelligence processing is set to receive a major boost with the dedicated NPU 9.0, targeting a remarkable 100 TOPS. This represents a significant increase over the estimated 50 TOPS of the current Dimensity 9400.
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