A recent leak on Weibo suggests that apart from the Snapdragon 845, Qualcomm is preparing at least three more chips for 2018 devices. Likely aimed at the mid-range segment, these are the Snapdragon 670, 640 and 460.
The Snapdragon 670 is an octa-core processor that uses 4 Kryo 360 cores at 2GHz, and 4 slower Kryo 385 cores at 1.6GHz. It uses an Adreno 620 GPU and is built on a 10nm process, which should translate to improved power efficiency. It can also support up to a 26MP single camera unit, or dual 13MP units.
The Snapdragon 640 on the other hand, utilizes 8 Kryo 360 cores, 2 at 2.15GHz, and 6 at 1.55GHz. It uses an Adreno 610 GPU, but is equipped with the same ISP as the SD670.
Finally, there’s the Snapdragon 460, a chip built on a 14nm process and is probably intended for budget smartphones. It utilizes the same X12 LTE modem as the 640, has 8 Kryo 360 cores – 4 at 1.8GHz, and 4 at 1.4GHz, and is fitted with the Spectra 240 ISP which supports up to a 21MP single camera unit.
Whether this leak is 100% accurate remains to be a question. Regardless, this makes us even more excited for the new devices that we’ll see in 2018.
Source: GSMArena, Photo: Ars Technica
Emman Tortoza
Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.
View all articles →
