TECNO has unveiled a groundbreaking modular smartphone concept. Measuring at 4.9mm in thickness, the device introduces a sophisticated “Modular Magnetic Interconnection” system that allows users to hot-swap hardware components with ease.
TECNO Ultra-slim Modular Phone
TECNO’s approach focuses on a sleek, integrated aesthetic. The phone’s matte-glass back is divided into eight zones that guide the attachment of roughly 10 available modules. These accessories include a 4.5mm ultra-slim power bank, a professional-grade telephoto lens, and an action camera. Impressively, even with the battery module attached, the device remains as thin as a standard modern flagship.
The device uses a hybrid connection architecture: a rectangular magnetic array ensures a secure physical fit, while physical pogo pins enable efficient power delivery. To eliminate bulky data ports, the modules connect wirelessly using a seamless blend of Wi-Fi, Bluetooth, and high-speed mmWave technology.
Available in two design styles, the “ATOM Edition” and “MODA Edition”, the concept aims to solve the “one-size-fits-all” hardware limitation. By allowing users to carry only the features they need, TECNO envisions a future where AI computing, imaging, and battery life can be upgraded without replacing the entire handset.
Started his freelancing adventure in 2018 and began doing freelance Audio Engineering work and then started freelance writing a few years later.
Currently he writes for Gadget Pilipinas and Grit.PH.
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