Infinix has just announced its new 3D Vapor Cloud Chamber (3D VCC) liquid cooling solution for smartphones.
The cooling system is based on the 3D VCC liquid cooling system and uses an innovative design on the dimensions of the chamber’s shape that increases its volume. This design choice also results in improved heat dissipation which then enhances performance.
The 3D VCC system aims to address high temp issues for high-integration and high-power phones thus reducing the problems like CPU frequency reduction, frozen screens, drop in frame rate, and other performance issues caused by high temps.
Moreover, the bumps in the system design generated up to a 20% improvement in capacity regarding the evaporator’s max volume and water storage.
In addition, the Infinix 3D Vapor Cloud Chamber can also be combined with the phone’s center frame into a single piece to reduce the size of the entire cooling system. This can result in thinner phones that can still remain fairly affordable.
As of now, there have been no reports regarding upcoming phones that will feature this new technology.