MediaTek has just unveiled the Dimensity 9000 5G chipset, the world’s first chipset built on the TSMC 4nm process. Being built on a smaller process, the new flagship chipset should have improved performance and power efficiency.
The chipset has a 1+3+4 core arrangement with one Arm Cortex-X2 ‘Ultra-core’ clocked at 3.05GHz, three Arm Cortex-A710 ‘Super-cores’ clocked at 3.85GHz, and four Arm Cortex-A510 efficiency cores. It supports RAM of up to LPDDR5x with speeds of up to7500Mbps.
The 9000 5G is equipped with the world’s first Arm Mali-G710 MC10 GPU with raytracing SDK using Vulkan for Android. It also supports up to 180Hz FullHD+ displays.
Its AI processing unit is also said to offer up to 4x power efficiency compared to the last generation.
The 18-bit HDR-ISP design is also said to capture HDR video on three cameras simultaneously with three exposures per frame. Additionally, it supports up to 320MP cameras on smartphones.
Meanwhile, the 5G modem on the new flagship SoC complies with the 3GPP Release-16 standard that boosts the sub-6GHz 5G performance. This is said to offer download speeds of up to 7Gbps with 3CC Carrier Aggregation (300MHz). The modem is also the only modem on the smartphone to support R16 UL Tx Switching for both SUL and NR UL-CA-based connections.
While we’re on the topic of connectivity, the chipset is the first smartphone to support Bluetooth 5.3. Additionally, it supports Wi-Fi 2×2 (BW160), Bluetooth LE Audio-ready technology, and new Beidou III-B1C GNSS support.
According to Mediatek, the first smartphones powered by the new Dimensity 9000 chipset will be unveiled in late Q1.