Qualcomm has just unveiled the Snapdragon 888 Plus at Mobile World Congress 2021. It features a 3GHz prime CPU core and improved AI Engine which is said to perform 20% better.
It’s pretty much the same chipset as its non-Plus sibling but its ARM Cortex-X1 prime core is clocked boosted to 2.995 GHz.
Additionally, the Qualcomm Hexagon 780 AI processor can now deliver 32 TOPS (Tera Operations per Second) up from 26 TOPS on its base sibling.
As we said, it is pretty much the same with an Adreno 660 GPU, Snapdragon X60 5G modem with 7.5 Gbps top DL speed, and FastConnect 6900.
ASUS, HONOR, Motorola, Xiaomi, and vivo have already confirmed that they will use the Qualcomm Snapdragon 888 Plus chipset in their upcoming smartphones. Devices packing the new chipset are expected to be available as early as Q3 2021.