The ZenFone Max Shot and Max Plus M2 are the first smartphones powered by the Qualcomm Snapdragon System-in-Package (SiP) 1. This is a month after it was announced that Qualcomm would partner with Universal Scientific Industrial (USI) on a new semiconductor plant in Sao Paulo, Brazil.
The Max Shot will offer an extra 8MP wide-angle camera in the back while the Max Plus M2 will simply have a flash sensor in that spot. Both devices will have the same 6.26-inch FHD+ notched IPS panel.
The Max Plus M2 will come in a single configuration with 3GB RAM and 32GB of internal storage while the Max Shot will get a 3GB RAM/32GB internal storage and 4GB RAM/64GB internal storage. Both of the phones have dual sim capabilities and a micro SD slot.
Unlike the traditional system-on-chip (SoC) processors, SiP brings all major components in a single circuit which later goes onto the motherboard. It saves valuable space that can be allocated for other components inside the phone, allowing for more innovative designs.
The 14nm chipset is essentially identical to the budget Snapdragon 450 with its 1.8GHz octa-core CPU and Adreno 506 GPU.
The Max Shot features a 12 MP regular, 8 MP wide angle, and a 5 MP depth sensor camera setup. The Max Plus M2, on the other hand, has a 12 MP regular and 5MP depth sensor combination. On the front, both phones offer an 8 MP camera with LED flash.
Powering both devices is a 4000mAh battery that is housed in their aluminum bodies. Both also run on Stock Android 8.1 Oreo with a Pie update promised in the coming months.
The ZenFone Max Shot will start at BRL 1349 (around PHP 18,624.09) and can go up to BRL 1,699 (around PHP 23,456.14) while the ZenFone Max Plus M2 will retail for BRL 1,299 (around PHP 17,934.14). Both phones are available on the ASUS Brazil Website in silver, black, blue, and red.