Vivo will showcase multiple industry-leading technologies at this year’s Mobile World Congress Shanghai, which will be held at the Shanghai New International Expo Center from June 28, 2017 to July 1, 2017, and is expected to be attended by over 650 manufacturers from various fields in the mobile industry.
Under Display Fingerprint Scanning Solution: A Real Full Screen Display
Perhaps the most notable in the list is the Under Display Fingerprint Scanning Solution, also known as Vivo Under Display. This is the first time that it will be demonstrated by a phone manufacturer.
In the company’s R&D plan, a fingerprint scanner will not be in the form of an independent button or region, but will be placed subtly under the screen, behind the metal shell, or even in the frame of the phone itself.
Vivo Under Display is a breakthrough unlocking solution based on Qualcomm’s Fingerprint Sensors. This feat is achieved using ultrasound from the sensor that can penetrate an OLED display up to 1.2mm thick. This gives it a tremendous advantage in terms of water-proofing and anti-ambient light.
Since the technology doesn’t require a physical button, it allows for a true full-screen display with an integrated unibody and mechanical waterproofing design. This in turn promotes innovative changes in overall smartphone appearance. The technology can also be further expanded into gesture recognition, security verification and other fields, which will greatly improve the user experience.
Independent DSP Photography Solution: Improved backlighting and Night Scene Photography
Vivo will also introduce its brand new independent DSP Photography Solution, which is touted to enhance photo quality in complex lighting conditions.
The Vivo DSP Photography Solution is designed to aid users in taking high quality photos with accurate exposure, and adjusts the brightness of the image to make it as close to what can be seen by the human eye. It also enhances the overall photography processing speed.
In theory, this should enable smartphones to take RAW pictures quickly even when shooting in complex lighting conditions. The DSP chip will automatically process and compose a single RAW image, which will then be exported to JPG format.
The DSP Photography Solution also reduces noise for night photography to a great extent, and even improves Vivo’s Face Beauty Mode.
New Customized DAC Decoder Chip and Headphone Amplifier Technology
Devices equipped with High-Fidelity Audio (Hi-Fi) can provide users with an immersive and high quality listening experience.
Vivo has established itself in the mobile phone audio industry as one of the pioneers of Hi-Fi capable smartphones through its generations of products, and has even promoted the development of the audio chip industry. After bringing Hi-Fi audio to new heights with the Xplay6 smartphone, the company is releasing a new customized DAC encoding chip that provides improved audio performance.
This new solution focuses on perfecting details using a customized DAC decoding chip and headphone amplifier, which greatly improves SNR, Dynamic Range, distortion, and output power. It’s even better than the Xplay6.
This solution has twice the output amplitude as ordinary phones. It has better resolution and thrust, rich details, and strong spatial perception. The headphone amplifier also makes use of an all new processing technology to improve power efficiency as well as the overall listening experience.
“Major brands have been taking actions to take in an advantageous position in the market this year. From process innovations in smartphone casings to dual lenses for both front and back cameras, and finally design breakthroughs in appearance, the smartphone industry has entered a new round of technological competition.”
“We are set to increase our technology capabilities and bring better products to our consumers. That is how we keep our brand’s competitiveness in the long run.” – Alex Feng, Senior Vice President of Vivo
Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.